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 HDMI Receiver Port Protection and Interface Device CM2021-02TR
Features
* * * * HDMI 1.3 compliant 0.05pF matching capacitance between the TMDS intra-pair Level shifting/isolation circuitry Provides ESD protection to IEC61000-4-2 Level 4: 8kV contact discharge 15kV air discharge Matched 0.5mm trace spacing (TSSOP) Simplified layout for HDMI connectors Backdrive protection RoHS-compliant, lead-free packaging
Product Description
The CM2021-02TR HDMI Receiver Port Protection and Interface Device is specifically designed for next generation HDMI Host interface protection. An integrated package provides all ESD, level shift and backdrive protection for an HDMI port in a single 38-Pin TSSOP package. The CM2021-02TR part is specifically designed to complement the CM2020 protection part in HDMI transmitters (DVD, STB/OPVR, etc.).
* * * *
Applications
* * * PC Consumer electronics Displays and digital television
(c)2010 SCILLC. All rights reserved. May 2010 - Rev. 3
Publication Order Number: CM2021-02TR/D
CM2021-02TR
Electrical Schematic
Rev. 3 | Page 2 of 12 | www.onsemi.com
CM2021-02TR
PIN DESCRIPTIONS
PINS 4, 35 6, 33 7, 32 9, 30 10, 29 12, 27 13, 26 15, 24 16 23 17 22 18 21 19 20 2 1 37 NAME TMDS_D2+ TMDS_D2- TMDS_D1+ TMDS_D1- TMDS_D0+ TMDS_D0- TMDS_CK+ TMDS_CK- CE_REMOTE_IN CE_REMOTE_OUT DDC_CLK_IN DDC_CLK_OUT DDC_DAT_IN DDC_DAT_OUT HOTPLUG_DET_IN HOTPLUG_DET_OUT LV_SUPPLY 5V_SUPPLY ESD_BYP ESD Level 8kV 8kV 8kV 8kV 8kV 8kV 8kV 8kV 2kV 8kV 2kV 8kV 2kV 8kV 2kV 8kV 2kV 2kV 2kV
2 2
DESCRIPTION TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection. TMDS 0.9pF ESD protection.
1 1
2
1
2
1
2
1
2
1
2
1
2
1
3
LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. LV_SUPPLY referenced logic level into ASIC. 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. Bias for CE / DDC / HOTPLUG level shifters. Current source for 5V_OUT. This pin may be connected to a 0.1 F ceramic capacitor, but it is not necessary. TMDS ESD and Parasitic GND return.
4
2
3
2
3
2
3
2
3
3
3
5, 34, 8, 31, 11, 28, 14, 25 3, 36 38
TMDS_GND
N/A
GND NC
N/A N/A
Supply GND reference. No connect.
Note 1: These 2 pins need to be connected together in-line on the PCB. Note 2: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, each bypassed with a 0.1F ceramic capacitor connected to GND. Note 3: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5k, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, and each bypassed with a 0.1F ceramic capacitor connected to GND. Note 4: These pins should be routed directly to the associated GND pins on the HDMI connector with single point ground vias at the connector
Rev. 3 | Page 3 of 12 | www.onsemi.com
CM2021-02TR
Backdrive Protection
Two scenarios below describe what can happen when a powered device is connected to an unpowered device via an HDMI interface, substantiating the need for backdrive protection for this type of interface. In a classic scenario, a DVD player is connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD's power supply has some form of bulk supply capacitance associated with it. Because all CMOS logic exhibits a very high impedance on the power rail node when "off," if there is very little parasitic shunt resistance and as little as a few milliamps of "backdrive" current flowing back into the power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level rises above the power-on-reset (POR) voltage level of some of the integrated circuits in the DVD player, these devices may not reset properly when the DVD player is turned back on. In a more serious scenario, if any SOC devices are incorporated in the design which have built-in level shifter and DRC diodes for ESD protection, there is even a higher risk for damage. In this case, if there is a pullup resistor (such as with DDC) on the other end of the cable, that resistance will pull the SOC chips "output" up to a high level. This will forward bias the upper ESD diode in the DRC and charge the bulk capacitance in a similar fashion like above. If the current flow is high enough, even as little as a few milliamps, it could destroy one of the SOC chip's internal DRC diodes, as they are not designed for passing DC. To avoid either of these situations, the CM2021-02TR is designed to block backdrive current, guaranteeing no more than 5A on any I/O pin when the I/O pin voltage is greater than the CM2021-02TR supply voltage.
Figure 1. Backdrive Protection Diagram
Rev. 3 | Page 4 of 12 | www.onsemi.com
CM2021-02TR
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish Pins 38 Package TSSOP-38 Ordering Part Number CM2021-02TR
1
Part Marking CM2021-02TR
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER VCC5V, VCCLV DC Voltage at any Channel Input Storage Temperature Range RATING 6.0 6.0 -65 to +150 UNITS V V uC
STANDARD (RECOMMENDED) OPERATING CONDITIONS
SYMBOL 5V_SUPPLY LV_SUPPLY PARAMETER Operating Supply Voltage Bias Supply Voltage Operating Temperature Range MIN GND 1 -40 TYP 5 3.3 MAX 5.5 5.5 85 UNITS V V uC
Rev. 3 | Page 5 of 12 | www.onsemi.com
CM2021-02TR
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL ICC5V ICCLV IOFF IBACKDRIVE PARAMETER Operating Supply Current Bias Supply Current OFF state leakage current, level shifting NFET Current conducted from output pins to V_SUPPLY rails when powered down CONDITIONS 5V_SUPPLY = 5.0V LV_SUPPLY = 3.3V LV_SUPPLY = 0V 5V_SUPPLY VCH_OUT; Signal pins: TMDS_[2:0]+/-, TMDS_CK+/-, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT Only CE-REMOTE_IN = CE_SUPPLY < CE_REMOTE_OUT LV_SUPPLY = 2.5V, VS = GND, IDS = 3mA IF = 8mA, TA = 25uC; Note 2 Pins 4, 7,10,13, 20, 21, 22, 23, 24, 27, 30, 33; Notes 2 and 3 TA = 25uC, IPP = 1A, tP = 8/20s; Notes 2 and 4 TA = 25uC, IPP = 1A, tP = 8/20s; Notes 2 and 4 TA = 25uC; Note 2 5V_SUPPLY = 5.0V, Measured at 1MHz, VBIAS=2.5V; Note 2 5V_SUPPLY = 5.0V, Measured at 1MHz, VBIAS=2.5V; Notes 2 and 5
(SEE NOTE 1)
MIN
TYP 110 1 0.1 0.1
MAX 130 5 5 5
UNITS A A A
A
IBACKDRIVE, CEC
Current through CE-REMOTE_OUT when powered down VOLTAGE drop across level shifting NFET when ON Diode Forward Voltage Top Diode Bottom Diode ESD Withstand Voltage (IEC)
0.1
1
A
VON
75
95
140
mV
VF
0.6 0.6 8
0.85 0.85
0.95 0.95
V V kV
VESD
VCL
Channel Clamp Voltage Positive Transients Negative Transients Dynamic Resistance Positive Transients Negative Transients TMDS Channel Leakage Current TMDS Channel Input Capacitance
11.0 -2.0 1.2 0.9 0.01 1
V V
RDYN
A
ILEAK
CIN, TMDS
0.9
1.2
pF
C
IN,
TMDS
TMDS Channel Input Capacitance Matching
0.05
pF
Rev. 3 | Page 6 of 12 | www.onsemi.com
CM2021-02TR
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
CIN, DDC
Level Shifting Input Capacitance, Capacitance to GND
5V_SUPPLY = 5V, Measured at 100KHz, VBIAS=2.5V; Note 2 5V_SUPPLY = 5V, Measured at 100KHz, VBIAS=2.5V; Note 2 5V_SUPPLY = 5V, Measured at 100KHz, VBIAS=2.5V; Note 2
3.5
4
pF
CIN, CEC
Level Shifting Input Capacitance, Capacitance to GND
3.5
4
pF
CIN, HP
Level Shifting Input Capacitance, Capacitance to GND
3.5
4
pF
Note 1: Operating characteristics are over standard operating conditions unless otherwise specified. Note 2: This parameter is guaranteed by design and verified by device characterization. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V, each bypassed with a 0.1F ceramic capacitor connected to GND. Note 4: These measurements performed with no external capacitor on ESD_BYP. Note 5: Intra-pair matching, each TMDS pair (i.e. D+, D-)
Rev. 3 | Page 7 of 12 | www.onsemi.com
CM2021-02TR
Performance Information
Typical Filter Performance (TA=25uC, DC Bias=0V, 50 Ohm Environment)
Figure 2. Insertion Loss vs. Frequency (TMDS_D1- to GND)
Rev. 3 | Page 8 of 12 | www.onsemi.com
CM2021-02TR
Application Information
DCEC
Figure 3. Typical Application for CM2021-02TR
Rev. 3 | Page 9 of 12 | www.onsemi.com
CM2021-02TR
Application Information
Design Considerations 1. DUT On vs. DUT Off Many HDMI CTS tests require a power off condition on the System Under Test. Many Dual Rail Clamp (DRC) ESD diode configurations will be forward biased when their VDD rail is lower than the I/O pin bias, thereby exhibiting extremely high apparent capacitance measurements, for example. The MediaGuard backdrive isolation circuitry limits this current to less than 10 A, and will help ensure HDMI compliance. 2. EEPROM Configurations The EDID EEPROM may be connected to either the ASIC LV domain or Connector 5V domain of the CM2021. See the MediaGuard EEPROM Application Note for further circuit connection and layout examples.
Figure 4. Design Example
Rev. 3 | Page 10 of 12 | www.onsemi.com
CM2021-02TR
Mechanical Details
TSSOP-38 Mechanical Specifications CM2021-02TR devices are supplied in 38-pin TSSOP packages. Dimensions are presented below. For complete information on the TSSOP-38, see the California Micro Devices TSSOP Package Information document.
PACKAGE DIMENSIONS
Package JEDEC No. Pins Dimensions Millimeters Min A A1 b c D E E1 e L # per tape and reel -- 0.05 0.17 0.09 9.60 Max 1.20 0.15 0.27 0.20 9.80 Min -- 0.002 0.007 0.004 0.378 TSSOP MO-153 (Variation BD-1) 38 Inches Max 0.047 0.006 0.011 0.008 0.386
6.40 BSC 4.30 4.50
0.252 BSC 0.169 0.177
0.50 BSC 0.45 0.75
0.020 BSC 0.018 0.030
2500 pieces
Controlling dimension: millimeters
Package Dimensions for TSSOP-38
Rev. 3 | Page 11 of 12 | www.onsemi.com
CM2021-02TR
Tape and Reel Specifications
PACKAGE SIZE (mm) 9.70 X 6.40 X 1.20 POCKET SIZE (mm) B0 X A0 X K0 10.20 X 6.90 X 1.80 TAPE WIDTH W 16mm REEL DIAMETER 330mm (13") QTY PER REEL 2500
PART NUMBER CM2021-02TR
P0 4mm
P1 12mm
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
Rev. 3 | Page 12 of 12 | www.onsemi.com


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